Path: Top -> Journal -> Telkomnika -> 2018 -> Vol. 16, No. 1, February

OFET Preparation by Lithography and Thin Film Depositions Process

Journal from gdlhub / 2018-05-30 11:31:23
Oleh : Sujarwata Sujarwata, Fianti Fianti, Langlang Handayani, Aji Purwinarko, Susilo Susilo, Telkomnika
Dibuat : 2018-05-30, dengan 1 file

Keyword : Lithography; OFET; bottom contact; channel;
Url : http://journal.uad.ac.id/index.php/TELKOMNIKA/article/view/6544
Sumber pengambilan dokumen : WEB

The length of the channel OFET based thin film is determined during preparation takes place using the technique of lithography and mask during the metal deposition process. The lithography technique is the basic process steps in the manufacture of semiconductor devices. Lithography is the process of moving geometric shapes mask pattern to a thin film of material that is sensitive to light. The pattern of geometric shapes on a mask has specifications, as follows: long-distance source and drain channels varied, i.e. 100 μm, the width of the source and drain are made permanent. Bottom contact OFET structure has been created using a combination of lithography and thin film deposition processes.

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PropertiNilai Properti
ID Publishergdlhub
OrganisasiTelkomnika
Nama KontakHerti Yani, S.Kom
AlamatJln. Jenderal Sudirman
KotaJambi
DaerahJambi
NegaraIndonesia
Telepon0741-35095
Fax0741-35093
E-mail Administratorelibrarystikom@gmail.com
E-mail CKOelibrarystikom@gmail.com

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